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| PRODUCT SPECIFICATIONS (R) Integrated Circuits Group LH28F800BVHE-BTL90 8M (1M x8/512K x 16) (Model No.: LHF80V13) Flash Memory Spec No.: EL109049A Issue Date: December 1, 1998 SHARP LHFSOV13 l Handle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. l When using the products covered herein, please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions. (1) The products covered herein are designed and manufactured for the following application areas. When using the products covered herein for the equipment listed in Paragraph (2), even for the following application areas, be sure to observe the precautions given in Paragraph (2). Never use the products for the equipment listed in Paragraph (3). *Office electronics *Instrumentation and measuring equipment *Machine tools *Audiovisual equipment *Home appliance l Communication equipment other than for trunk lines (2) Those contemplating using the products covered herein for the following equipment which demands high reliabilitv, should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail-safe operation, redundancy, and other appropriate measures for ensuring reliability and safety of the equipment and the overall system. *Control and safety devices for airplanes, trains, automobiles, transportation equipment *Mainframe computers @Traffic control systems @Gas leak detectors and automatic cutoff devices *Rescue and security equipment *Other safety devices and safety equipment, etc. and other (3) Do not use the products covered herein for the following equipment which demands extremelv high performance in terms of functionality, reliability, or accuracy. *Aerospace equipment l Communications equipment for trunk lines *Control equipment for the nuclear power industry l Medical equipment related to life support, etc. (4) Please direct all queries and comments regarding the interpretation of the above three Paragraphs to a sales representative of the company. aPlease direct all queries regarding the products covered herein to a sales representative of the company. Rev. 1.01 SHARP LHF8OVl3 1 CONTENTS PAGE 1 INTRODUCTION.. ............................................................ 3 3 5 DESIGN CONSIDERATIONS PAGE ...................................... 20 1.1 Features ........................................................................ 5.1 Three-Line Output Control ....................................... 20 5.2 RY/BY# and Block Erase and Word/Byte Write Polling.. .................................................................... 20 5.3 Power Supply Decoupling ........................................ 20 5.4 V,, Trace on Printed Circuit Boards ........................ 20 5.5 V,,, V,, RP##Transitions.. ..................................... 21 Protection.. .................................... 21 5.6 Power-Up/Down 1.2 Product Overview. ........................................................ 3 2 PRINCIPLES OF OPERATION.. ..................................... .7 2.1 Data Protection.. ........................................................... 8 3,BUS OPERATION ........................................................... .8 8 8 3.1 Read .............................................................................. 3.3 Standby.. ....................................................................... 3.4 Deep Power-Down 5.7 Power Dissipation ..................................................... 21 6 ELECTRICAL SPECIFICATIONS ............................... 22 3.2 Output Disable.. ............................................................ 8 ...................................................... .8 9 6.1 Absolute Maximum Ratings ..................................... 22 6.2 Operating Conditions ................................................ 22 6.2.1 Capacitance ......................................................... 22 6.2.2 AC Input/Output Test Conditions ....................... 23 4 COMMAXD DEFINITIONS.. .......................................... .9 6.2.3 DC Characteristics .............................................. 24 6.2.4 AC Characteristics - Read-Only Operations.. ..... 26 6.2.5 AC Characteristics - Write Operations ............... 29 6.2.6 Alternative CE#-Controlled Writes.. ................... 3 1 6.2.7 Reset Operations ................................................. 33 6.2.8 Block Erase and Word/Byte Write Performance 34 7 PACKAGE AND PACKING SPECIFICATIONS.. ...... .35 4.1 Read Array Command ................................................ 12 4.2 Read Identifier Codes Command ............................... 12 4.3 Read Status Register Command.. ............................... 12 4.4 Clear Status Register Command.. ............................... 12 4.5 Block Erase Command. .............................................. 12 4.6 Word/Byte Write Command.. ..................................... 13 4.7 Block Erase Suspend Command ................................ 13 4.8 Word/Byte Write Suspend Command.. ...................... 14 4.9 Considerations of Suspend ......................................... 14 4.10 Block Locking .......................................................... 14 4.10.1 V,,=V,, 4.10.3 WP#=V,, for Complete Protection.. .................... 14 for Block Unlocking.. ........................ 14 4.10.2 WP#=V,, for Block Locking.. ............................ 14 3.5 Read Identifier Codes Operation.. ............................... .9 3.6 Write ............................................................................. Rev. 1.0 SHARP LHF8OV13 2 LH28F8OOBVHE-BTL90 8M-BIT (1Mbit x 8 / 512Kbit x 16) Smart3 Flash MEMORY n Smart3 Technology - 2.7V-3.6V Vcc - 2.7V-3.6V or 11.4V-12.6V Vpp n User-Configurable x8 or x 16 Operation n Enhanced Data Protection Features - Absolute Protection with Vpp=GND - Block Erase and Word/Byte Write Lockout during Power Transitions - Boot Blocks Protection with WP#=VIL n Automated Word/Byte Write and Block Erase - Command User Interface - Status Register n Low Power Management - Deep Power-Down Mode - Automatic Power Savings Mode Decreases ICC in Static Mode n SRAM-Compatible Write Interface n Industry-Standard Packaging - 48-Lead TSOP n ETOXTM" Nonvolatile Flash Technology n CMOS Process (P-type silicon substrate) w Not designed or rated as radiation hardened n High-Performance Access Time - 90ns(2.7V-3.6V) n Operating Temperature - -40C to +85"C n Optimized Array Blocking Architecture - Two 4k-word Boot Blocks - Six 4k-word Parameter Blocks - Fifteen 32k-word Main Blocks - Bottom Boot Location n Extended Cycling Capability - 100,000 Block Erase Cycles n Enhanced Automated Suspend Options - Word/Byte Write Suspend to Read - Block Erase Suspend to Word/Byte Write - Block Erase Suspend to Read SHARP's LH28F800BVHE-BTL90 Flash memory with Smart3 technology is a high-density, low-cost, nonvolatile, read/write storage solution for a wide range of applications. LH28F800BVHE-BTL90 can operate at V,,=2.7V-3.6V and V,=2.7V-3.6V. Its low voltage operation capability realize battery life and suits for cellular phone application. [ts Boot, Parameter and Main-blocked architecture, flexible voltage and extended cycling provide for highly flexible component suitable for portable terminals and personal computers. Its enhanced suspend capabilities provide for an ideal solution for code + data storage applications. For secure code storage applications, such as networking, where code is either directly executed out of flash or downloaded to DRAM, the LH28F800BVHE-BTL90 offers two levels of protection: absolute protection with V,, at GND, selective hardware boot block locking. These alternatives give designers ultimate control of their code security needs. Ihe LH28F800BVHE-BTL90 is manufactured on SHARP's 0.35pm ETOXTM* process technology. It come in industrystandard package: the 48-lead TSOP ideal for board constrained applications. *ETOX is a trademark of Intel Corporation. Rev. 1.01 SHARP LHF8OV13 3 1 INTRODUCTION This datasheet contains LH28F8OOBVHE-BTL90 specifications. Section 1 provides a flash memory overview. Sections 2,3,4 and 5 describe the memory organization and functionality. Section 6 covers electrical specifications. eliminates the need for a separate 12V converter, while V,=l2V maximizes block erase and word/byte wriu performance. In addition to flexible erase and prograrr voltages, the dedicated V,, pin gives complete datr protection when V,, 5 VPPLK. Table 1. V,, and V,, Voltage Combinations Offered by Smart3 Technology V,, Voltage V,, Voltage 2.7V-3.6V, 11.4V- 12.6V ~ 2.7V-3.6V Internal V,, and V, detection Circuitry automatically configures the device for optimized read and write operations. A Command User Interface (CUI) serves as the interface between the system processor and internal operation of the device. A valid command sequence written to the CUI initiates device automation. An internal Write State Machine (WSM) automatically executes the algorithms and timings necessary for block erase and word/byte write operations. A block erase operation erases one of the device's 32Kword blocks typically within 0.51s (2.7V-3.6V V,,, 11.4V-12.6V V,,), 4K-word blocks typically within 0.3 1s (2.7V-3.6V V,,, 11.4V- 12.6V V,,) independent of other blocks. Each block can be independently erased 100,000 times. Block erase suspend mode allows system software to suspend block erase to read or write data from any other block. Writing memory data is performed in word/byte increments of the device's 32K-word blocks typically within 12.6~s (2.7V-3.6V V,,, 11.4V-12.6V V,,), 4Kword blocks typically within 24.5us (2.7V-3.6V V,,, 11.4V-12.6V V,,). Word/byte write suspend mode enables the system to read data or execute code from any other flash memory array location. 1.1 Features Key enhancements of LH28F800BVHE-BTL90 Flash memory are: *Smart3 Technology *Enhanced Suspend Capabilities *Boot Block Architecture Please note following important differences: Smart3 l VPPLK has been lowered to 1.5V to support 2.7V-3.6V block erase and word/byte write operations. The V, voltage transitions to GND is recommended for designs that switch V,, off during read operation. *To take advantage of Smart3 technology, allow V,, and V,,, connection to 2.7V-3.6V. 1.2 Product Overview The LH28F800BVHE-BTL90 is a high-performance 8Mbit Smart3 Flash memory organized as lM-byte of 8 bits or 512K-word of 16 bits. The lM-byte/512K-word of data is arranged in two 8K-byte/4K-word boot blocks, six 8K-byte/4K-word parameter blocks and fifteen 64Kbyte/32K-word main blocks which are individually erasable in-system. The memory map is shown in Figure 3. Smart3 technology provides a choice of V,, and V,, combinations, as shown in Table 1, to meet system performance and power expectations. V, at 2.7V-3.6V Rev. 1.1 LHF8OV13 The boot blocks can be locked for the WP# pin. Block erase or word/byte write for boot block must not be carried out by WP# to Low and RP# to V, The status register indicates when the WSM's block erase or word/byte write operation is finished. The RY/BY# output gives an additional indicator of WSM activity by providing both a hardware signal of status (versus software polling) and status masking (interrupt masking for background block erase, for example). Status polling using RY/BY# minimizes both CPU overhead and system power consumption. When low, RY/BY# indicates that the WSM is performing a block erase or word/byte write. RY/BY#-high Z indicates that the WSM is ready for a new command, block erase is suspended (and word/byte write is inactive), word/byte write is suspended, or the device is in deep power-down mode. The access time is 90 ns (tAv v> over the extended temperature range (-40C to +880 C) and V,, supply voltage range of 2.lV-3.6V. The Automatic Power Savings (APS) feature substantially reduces active current when the device is in static modt (addresses not switching). In APS mode, the typical I,, current is 3 mA at 2.7V V,,. When CE# and RP# pins are at V,,, the I,, CM05 standby mode is enabled. When the RP# pin is at GND deep power-down mode is enabled which minimize: power consumption and provides write protection during reset. A reset time (tpHQv) is required from RP# switching high until outputs are valid. Likewise, the device has : from RP#-high until writes to the CUI wake time (tp& are recognized. With RP# at GND, the WSM is reset ant the status register is cleared. The device is available in 48-lead TSOP (Thin Small Outline Package, 1.2 mm thick). Pinout is shown in Figure 2. Rev. 1.0 SHARP LHF8OV13 5 a3 WE# OE# RP# WP# I 1 Y Decoder Y-Gating I Write I ) RYiBY# Figure 1. Block Diagram AIS c== 1 A14 A13 A12 I 2 41 ho A9 I : 15 : = 3 4 0 48-LEAD TSOP STANDARD PINOUT 12mm x 20mm TOP VIEW 6 7 As NC NC wE# RP# VPP I I WP# RYIBY# 8 9 10 11 12 13 14 1.5 16 17 18 19 21 20 22 23 24 48 A17 A7 % 2 A3 A2 A, 48 47 46 45 44 43 a 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 A16 BYTE# GND DQdAI DQ7 DQM DQ6 DQI~ DQs DQIZ DQ4 DQ3 DQIO VCC DQI DQ2 DQg DQ1 DQs I I I 21 I 26 I 25 I OE# DQo GND CE# A0 Figure 2. TSOP 48-Lead Pinout Rev. 1.0 SHARP LHF8OV13 Table 2. Pin Descriptions Name and Function `Me ADDRESS INPUTS: Addresses are internally latched during a write cycle. : Byte Select Address. Not used in x16 mode. A-1 INPUT Au-A ,u : Row Address. Selects 1 of 2048 word lines. A,,-A,, : Column Address. Selects 1 of 16 bit lines. A,5-A,8 : Main Block Address. (Boot and Parameter block Addresses are A,2-A,8.) DATA INPUT/OUTPUTS : DQo-DQ7:Inputs data and commands during CUI write cycles; outputs data during memory array, status register and identifier code read cycles. Data pins float to high-impedance when the chip is INPUT/ deselected or outputs are disabled. Data is internally latched during a write cycle. OUTPUT DQs-DQrs:Inputs data during CUI write cycles in x16 mode; outputs data during memory array read cycles in x 16 mode; not used for status register and identifier code read mode. Data pins float to high-impedance when the chip is deselected, outputs are disabled, or in x8 mode (Byte#=V,,). Data is internally latched during a write cycle. INPUT CHIP ENABLE: Activates the device's control logic, input buffers, decoders and sense amplifiers. CE#-high deselects the device and reduces power consumption to standby levels. RESET/DEEP POWER-DOWN: Puts the device in deep power-down mode and resets internal automation. RP#/-high enables normal operation. When driven low, RP# inhibits write operations which provides data protection during power transitions. Exit from deep power-down sets the INPUT device to read array mode. With RP#=V HH, block erase or word/byte write can operate to all blocks without WP##state. Block erase or word/byte write with V,, Symbol A-1 Ao-Al 8 DQu-DQls CE# RP# OE# WE# WP# BYTE# RY/BY# VPP Vcc GND NC NO CONNECT: Lead is not internal connected;it may be driven or floated. Rev. 1.1 SHARP LHF8OV13 7 2 PRINCIPLES OF OPERATION Bottom The LH28F8OOBVHE-BTL90 Smart3 Flash memory includes an on-chip WSM to manage block erase and word/byte write functions. It allows for: 100% TTL-level control inputs, fixed power supplies during block erasure and word/byte write, and minimal processor overhead with RAM-like interface timings. After initial device power-up or return from deep powerdown mode (see Bus Operations), the device defaults to read array mode. Manipulation of external memory control pins allow array read, standby and output disable operations. Status register and identifier codes can be accessed through the CUI independent of the VP, voltage. High voltage on VP, enables successful block erasure and word/byte writing. All functions associated with altering memory contents-block erase, word/byte write, status and identifier codes-are accessed via the CUI and verified through the status register. Commands are written using standard microprocessor write timings. The CUI contents serve as input to the WSM, which controls the block erase and word/byte write. The internal algorithms are regulated by the WSM, including pulse repetition, internal verification and margining of data. Addresses and data are internally latch during write cycles. Writing the appropriate command outputs array data, accesses the identifier codes or outputs status register data. Interface software that initiates and polls progress of block erase and word/byte write can be stored in any block. This code is copied to and executed from system RAM during flash memory updates. After successful completion, reads are again possible via the Read Array command. Block erase suspend allows system software to suspend a block erase to read/write data from/to blocks other than that which is suspend. Word/byte write suspend allows system software to suspend a word/byte write to read data from any other flash memory array location. 7FFFF 78000 77FFF 7maO 6FFFF 68000 67FFF Boot 58OCO 57FFF 48OCQ 47FFF 28000 27FFF 2OOa 1FFFF 18000 17FFF 08000 07FFF 07OQO 06FFF 0% 05000 04FFF 04000 03FFF 03000 02FFF 02Om OIFFF OloOa OOFFF 4K-word Parameter Block 4K-word Parameter Block 4K-word Parameter Block 4K-word Boot Block 4K-word Boot Block 2 1 0 1 0 omoo Figure 3. Memory Map Rev. 1.0 SHARI= LHF8OV13 2.1 Data Protection Depending on the application, the system designer may choose to make the V, power supply switchable (available only when memory block erases or word/byte writes are required) or hardwired to V,,,,,. The device accommodates either design practice and encourages optimization of the processor-memory interface. When VppIVppLK, memory contents cannot be altered. The CUI, with two-step block erase or word/byte write command sequences, provides protection from unwanted operations even when high voltage is applied to V,,. All write functions are disabled when V,, is below the write lockout voltage VLKO or when RP# is at V,,. The device's boot blocks locking capability for WP# provides additional protection from inadvertent code or data alteration by block erase and word/byte write operations. Refer to Table 6 for write protection alternatives. 8 3.2 Output Disable With OE# at a logic-high level (V,,), the device output are disabled. Output pins (DQu-DQ15) are placed in a high-impedance state. 3.3 Standby CE# at a logic-high level (V,,) places the device in standby mode which substantially reduces device power consumption. DQo-DQ,, outputs are placed in a highimpedance state independent of OE#. If deselected during block erase or word/byte write, the device continues functioning, and consuming active power until the operation completes. 3.4 Deep Power-Down RP# at V, initiates the deep power-down mode. 3 BUS OPERATION The local CPU reads and writes flash memory in-system. All bus cycles to or from the flash memory conform to standard microprocessor bus cycles. 3.1 Read Information can be read from any block, identifier codes or status register independent of the V,, voltage. RP# can be at either VI, or V,. The first task is to write the appropriate read mode command (Read Array, Read Identifier Codes or Read Status Register) to the CUI. Upon initial device power-up or after exit from deep power-down mode, the device automatically resets to read array mode. Six control pins dictate the data flow in and out of the component: CE#, OE#, WE#, RP#, WP# and BYTE#. CE# and OE# must be driven active to obtain data at the outputs. CE# is the device selection control, and when active enables the selected memory device. OE# is the data output (DQo-DQls) control and when active drives the selected memory data onto the I/O bus. WE# must be at Vt, and RP# must be at V,, or V,,. Figure 11, 12 illustrates read cycle. In read modes, RP#-low deselects the memory, places output drivers in a high-impedance state and turns off all internal circuits. RP# must be held low for a minimum 01 100 ns. Time tpHQv is required after return from powerdown until initial memory access outputs are valid. After this wake-up interval, normal operation is restored. The CUI is reset to read array mode and status register is set to 80H. During block erase or word/byte write modes, RP#-low will abort the operation. RY/BY# remains low until the reset operation is complete. Memory contents being altered are no longer valid; the data may be partially erased or written. Time tpHWL is required after RP# goes to logic-high (V,,) before another command can be written. As with any automated device, it is important to assert RP# during system reset. When the system comes out of reset, it expects to read from the flash memory. Automated flash memories provide status information when accessed during block erase or word/byte write modes. If a CPU reset occurs with no flash memory reset, proper CPU initialization may not occur because the flash memory may be providing status information instead of array data. SHARP's flash memories allow proper CPU initialization following a system reset through the use of the RP# input. In this application, RP# is controlled by the same RESET# signal that resets the system CPU. Rev. 1.0 SHARI= LHF8OV13 3.6 Write Writing commands to the CUI enable reading of device data and identifier codes. They also control inspection and clearing of the status register. When V,,=2.7V-3.6V and V,=V,,,,, the CUI additionally controls block erasure and word/byte write. The Block Erase command requires appropriate command data and an address within the block to be erased. The WordByte Write command requires the command and address of the location to be written. The CUI does not occupy an addressable memory location. It is written when WE# and CE# are active. The address and data needed to execute a command are latched `on the rising edge of WE# or CE# (whichever goes high first). Standard microprocessor write timings are used. Figures 13 and 14 illustrate WE# and CE# controlled write operations. 9 3.5 Read Identifier Codes Operation The read identifier codes operation outputs the manufacturer code and device code (see Figure 4). Using the manufacturer and device codes, the system CPU can automatically match the device with its proper algorithms. LGA01 . 7* :;:,:: ,:',..,:, .f:`::,' .:;j, ;:; : ,;.,,,:,:;y):::j,:.:.: ::,::,,:I :;`.$ .,,,.. :: ,;' ,.., .I :.`; : ..:., .,.. .,,, :,.. : j ,,,::,,: `. ,.,.,:,. .:,.j..y:: ,.., ..,.,:....:' : .... .. :>:: :: `.. `. .. .:.. .. .:...:,. :.:. .,..I: :, y:. `,.,`j'. :,,, ,:i,......:., .ji :; :. : .I..`/./. .,., ,. ..:..,:,.:,`j.. ,`,..`.,,.:,,,,,,.., .: ,.`,`. . . `:. ..A.. .;y.:. :::,:: .,,:.,,. : .d:.:`.. .. . -:,; : :.I.`.'.. . .,,,, . :.:. .... 4 COMMAND Figure 4. Device Identifier Code Memory Map DEFINITIONS When the V, voltage I V,,,, Read operations from the status register, identifier codes, or blocks are enabled. Placing VPPHIR on V,, enables successful block erase and word/byte write operations. Device operations are selected by writing specific commands into the CUI. Table 4 defines these commands. Rev. 1.0 SHARP LHFSOV13 10 Deep Power-Down Read Identifier Codes Write 4,lO 8 6,7,8 v, !$Hor I-m X v, V, X v, VI, X VI, VIL X See Figure 4 X X X X High Z Note 5 DIN High Z High Z X ":" Or HH Mode Read Output Disable Standby Deep Power-Down Read Identifier Codes Write 76-m IuII2s: Notes 8 Table 3.2. Bus Operations(BYTE#=Vn.)(*,2) CE# OE# WE# Address RP## vIH `1, Or Or Or VP, X X X X X X , DQ,-7 D,,, High Z HighZ High Z Note 5 DIN DQ,-1, High Z High Z High Z High Z High Z X RY/BY#c3) X X X High Z High Z X VHH V, VIL VIL vIH VIH vIH X X X X See Figure 4 X VIL `1, 10 4,lO 8,9 677 78 ":" VI, HI-l ":" `IHor VI-II-I X X V, vIH X X vIH vIL X Or V, VIL HI-l . Refer to DC Characteristics. When V,r,5V,PLK, memory contents can be read, but not altered. and !. X can be Vu or VrB for control pins and addresses, and V,, or V,,,z for V,. See DC Characteristics for V,,, vPPHI/2 voltages. 1, RY/BY# is V,, when the WSM is executing internal block erase or word/byte write algorithms. It is High Z during when the WSM is not busy, in block erase suspend mode (with word/byte write inactive), word/byte write suspend mode or deep power-down mode. `. RP# at GNDk0.2V ensures the lowest deep power-down current. `. See Section 4.2 for read identifier code data. I. Command writes involving block erase or word/byte write are reliably executed when VPP=VPPHrjz and V,--=2.7V-3.6V. Block erase or word/byte write with VnrcRP# SHARP LHF8OV13 Table 4. Command Detinitions(7) NOTES: 1. BUS operations are defined in Table 3.1 and Table 3.2. 2. X=Any valid address within the device. IA=Identifier Code Address: see Figure 4. A-, set to V, or V,, in Byte Mode (BYTE#=V,). BA=Address within the block being erased. The each block can select by the address pin A,, through A,, combination. WA=Address of memory location to be written. 3. SRD=Data read from status register. See Table 7 for a description of the status register bits. WD=Data to be written at location WA. Data is latched on the rising edge of WE# or CE# (whichever goes high first). ID=Data read from identifier codes. 4. Following the Read Identifier Codes command, read operations access manufacturer and device codes. See Section 4.2 for read identifier code data. 5. If the block is boot block, WP# must be at V, or RP# must be at V,, to enable block erase or word/byte write operations. Attempts to issue a block erase or word/byte write to a boot block while WP# is V,, or RP# is V,,. 6. Either 40H or 10H are recognized by the WSM as the word/byte write setup. 7. Commands other than those shown above are reserved by SHARP for future device implementations and should not be used. Rev. 1.0 SHARP LHF8OV13 4.1 Read Array Command Upon initial device power-up and after exit from deep power-down mode, the device defaults to read array mode. This operation is also initiated by writing the Read Array command. The device remains enabled for reads until another command is written. Once the internal WSM has started a block erase or word/byte write, the device will not recognize the Read Array command until the WSM completes its operation unless the WSM is suspended via an Erase Suspend or Word/Byte Write Suspend command. The Read Array command functions independently of the V, voltage and RP# can be V,, or V,. 12 4.4 Clear Status Register Command Status register bits SR.5, SR.4, SR.3 or SR.1 are set to "1"s by the WSM and can only be reset by the Clear Status Register command. These bits indicate various failure conditions (see Table 7). By allowing system software to reset these bits, several operations (such as cumulatively erasing multiple blocks or writing several words/bytes in sequence) may be performed. The status register may bc polled to determine if an error occurred during the sequence. To clear the status register, the Clear Status Regista command (50H) is written. It functions independently o the applied V,, Voltage. RP# can be V,, or V,,. Thi: command is not functional during block erase OI .word/byte write suspend modes. 4.2 Read Identifier Codes Command The identifier code operation is initiated by writing the Read Identifier Codes command. Following the command write, read cycles from addresses shown in Figure 4 retrieve the manufacturer and device codes (see Table 5 for identifier code values). To terminate the operation, write another valid command. Like the Read Array command, the Read Identifier Codes command functions independently of the V, voltage and RP# can be V, or V,. Following the Read Identifier Codes command, the following information can be read: Table 5. Identifier Codes 4.5 Block Erase Command Erase is executed one block at a time and initiated by i two-cycle command. A block erase setup is first written followed by an block erase confirm. This commanc sequence requires appropriate sequencing and an address within the block to be erased (erase changes all block data to FFFFH). Block preconditioning, erase, and verify are handled internally by the WSM (invisible to the system). After the two-cycle block erase sequence is written, the device automatically outputs status register data when read (see Figure 5). The CPU can detect block erase completion by analyzing the output data of the RY/BY# pin or status register bit SR.7. When the block erase is complete, status register bit SR.5 should be checked. If a block erase error is detected, the status register should be cleared before system software attempts corrective actions. The CUI remains in read status register mode until a new command is issued. This two-step command sequence of set-up followed by execution ensures that block contents are not accidentally erased. An invalid Block Erase command sequence will result in both status register bits SR.4 and SR.5 being set to "1". Also, reliable block erasure can only occur when V,,=2.7V-3.6V and VPP=VPPH1,2. In the absence of this high voltage, block contents are protected against erasure. If block erase is attempted while V,,IV,,,,, SR.3 and SR.5 will be set to "1". Successful block erase for boot blocks requires that the corresponding if set, that WP#=V, or RP#=V,,. If block erase is attempted to boot block when the corresponding WP#=V,, or RP#=V,,, SR.l and SR.5 will be set to "1". Block erase operations with V,, The status register may be read to determine when a block erase or word/byte write is complete and whether the speration completed successfully. It may be read at any ime by writing the Read Status Register command. After writing this command, all subsequent read operations output data from the status register until another valid :ommand is written. The status register contents are atched on the falling edge of OE# or CE#, whichever occurs. OE# or CE# must toggle to V, before further .eads to update the status register latch. The Read Status tegister command functions independently of the V,, {ohage. RP# can be V,, or V,,. Rev. 1.0 SHARI= LHF8OV13 4.6 Word/Byte Write Command Word/byte write is executed by a two-cycle command sequence. Word/byte write setup (standard 40H or alternate 10H) is written, followed by a second write that specifies the address and data (latched on the rising edge of WE#). The WSM then takes over, controlling the word/byte write and write verify algorithms internally. After the word/byte write sequence is written, the device automatically outputs status register data when read (see Figure 6). The CPU can detect the completion of the word/byte write event by analyzing the RY/BY# pin or status register bit SR.7. When word/byte write is complete, status register bit SR.4 should be checked. If word/byte write error is detected, the status register should be cleared. The internal WSM verify only detects errors for "1"s that do not successfully write to "0"s. The CUI remains in read status register mode until it receives another command. Reliable word/byte writes can only occur when V,,=2.7V-3.6V and VPP=VPPH,,2. In the absence of this high voltage, memory contents are protected against word/byte writes. If word/byte write is attempted while V,,IV,,, status register bits SR.3 and SR.4 will be set to "1". Successful word/byte write for boot blocks requires that the corresponding if set, that WP#=V,, or RP#=V,. If word/byte write is attempted to boot block when the corresponding WP#=V, or RP#=V,,, SR.1 and SR.4 will be set to "1". Word/byte write operations with V,&P# 4.7 Block Erase Suspend Command The Block Erase Suspendcommandallows block-erase interruption to read or word/byte write data in another block of memory. Once the block-eraseprocessstarts, writing the Block Erase Suspend commandrequeststhat the WSM suspend the block erase sequence at a predetermined point in the algorithm. The device outputs status register data when read after the Block Erase Suspendcommandis written. Polling statusregister bits SR.7 and SR.6 can determine when the block erase operation has been suspended (both will be set to "1"). RY/BY# will also transition to High Z. Specification twHRz2definesthe block erasesuspend latency. At this point, a Read Array commandcan be written to ,readdata from blocks other than that which is suspended. A Word/Byte Write commandsequence alsobe issued can during erase suspendto program data in other blocks. Using the Word/Byte Write Suspend command (see Section 4.8), a word/byte write operation can also be suspended. During a word/byte write operationwith block erasesuspended, statusregisterbit SR.7 will return to "0" and the RY/BY# output will transition to VOL. However, SR.6 will remain "1" to indicate block erase suspend status. The only other valid commandswhile block erase is suspendedare Read Status Register and Block Erase Resume. After a Block EraseResume command written is to the flash memory, the WSM will continue the block erase process.Status register bits SR.6 and SR.7 will automatically clear and RY/BY# will return to VOL. After the Erase Resume command is written, the device automatically outputs statusregister data when read (see Figure 7). V, must remain at V,,,,,, (the sameV,, level usedfor block erase)while block eraseis suspended. RP# mustalsoremainat V,, or V,, (the same RP# level usedfor block erase). WP# mustalsoremainat VIL or V,, (the sameWP# level usedfor block erase).Block erase cannot resumeuntil word/byte write operationsinitiated during block erasesuspend have completed. Rev. 1.0 SHARP LHF8OV13 4.8 Word/Byte Write Suspend Command The Word/Byte Write Suspend command allows word/byte write interruption to read data in other flash memory locations. Once the word/byte write process starts, writing the Word/Byte Write Suspend command requests that the WSM suspend the word/byte write sequence at a predetermined point in the algorithm. The device continues to output status register data when read after the Word/Byte Write Suspend command is written. Polling status register bits SR.7 and SR.2 can determine when the word/byte write operation has been suspended (both will be set to "1"). RY/BY# will also transition to High Z. Specification twHRZl defines the word/byte write suspend latency. At this point, a Read Array command can be written to read data from locations other than that which is suspended. The only other valid commands while word/byte write is suspended are Read Status Register and Word/Byte Write Resume. After Word/Byte Write Resume command is written to the flash memory, the WSM will continue the word/byte write process. Status register bits SR.2 and SR.7 will automatically clear and RYlBY# will return to V,,. After the Word/Byte Write Resume command is written, the device automatically outputs status register data when read (see Figure 8). V,, must remain at V,,,,, (the same V,, level used for word/byte write) while in word/byte write suspend mode. RP# must also remain at V, or V,, (the same RP# level used for word/byte write). WP# must also remain at V, or V, (the same WP# level used for word/byte write). 14 4.10 Block Locking This Boot Block Flash memory architecture features two hardware-lockable boot blocks so that the kernel code for the system can be kept secure while other blocks are programmed or erased as necessary. 4.10.1 Vpp=v~ for Complete Protection The V, programming voltage can be held low for complete write protection of all blocks in the flash device. 4.10.2 WP#=V,, for Block Locking The lockable blocks are locked when WP#=V,; any .program or erase operation to a locked block will result in an error, which will be reflected in the status register. For top configuration, the top two boot blocks are lockable. For the bottom configuration, the bottom tow boot blocks are lockable. Unlocked blocks can be programmed or erased normally (Unless V, is below V,,,). 4.10.3 WP#=VIH for Block Unlocking WP#=V,, unlocks all lockable blocks. These blocks can now be programmed or erased. WP# controls 2 boot blocks locking and V,, provides protection against spurious writes. Table 6 defines the write protection methods. 4.9 Considerations of Suspend After the suspend command write to the CUI, read status register command has to write to CUI, then status register bit SR.6 or SR.2 should be checked for places the device in suspend mode. Operation Block Erase or Word/Byte Write VP, V, "PPLK RP# X VI, `HH vlH Table 6. Write Protection Alternatives WP# X All Blocks Locked. X All Blocks Locked. X All Blocks Unlocked. 2 Boot Blocks Locked. `IL All Blocks Unlocked. `1, Effect Rev. 1.0 SHARP LHF8OV13 15 Table 7. Status Register Definition 1 WBWS 1 1 WBWSS VPPS 4 3 2 NOTES: SR.7 = WRITE STATE MACHINE 1 = Ready 0 = Busy STATUS (WSMS) Check RY/BY# word/byte write SR.7="0". or SR.7 to determine block erase OK completion. SR.6-0 are invalid while WSMS 7 1 ESS 6 ES 5 1 DPS 1 R 0 SR.6 = ERASE SUSPEND STATUS (ESS) 1 = Block Erase Suspended 0 = Block Erase in Progress/Completed SR.5 = ERASE STATUS (ES) 1 = Error in Block Erasure 0 = Successful Block Erase SR.4 = WORD/BYTE WRITE STATUS (WBWS) 1 = Error in Word/Byte Write 0 = Successful Word/Byte Write SR.3 = V, STATUS (VPPS) 1 = V, Low Detect, Operation Abort O=V,OK SR.2 = WORD/BYTE WRITE SUSPEND STATUS (WBWSS) 1 = Word/Byte Write Suspended 0 = Word/Byte Write in Progress/Completed SR.1 = DEVICE PROTECT STATUS (DPS) 1 = WP# or RP# Lock Detected, Operation Abort 0 = Unlock SR.0 = RESERVED FOR FUTURE ENHANCEMENTS (R) SR.3 does not provide a continuous indication of V,, level. The WSM interrogates and indicates the V,, level only after Block Erase or Word/Byte Write command sequences. SR.3 is not guaranteed to reports accurate feedback only when vPP~vPPHll2~ If both SR.5 and SR.4 are "1"s after a block erase attempt, an improper command sequence was entered. The WSM interrogates the WP# and RP# only after Block Erase or Word/Byte Write command sequences. It informs the system, depending on the attempted operation, if the WI% is not V,, RP# is not V,. SR.0 is reserved for future use and should be masked out when polling the status register. . Rev. 1.0 SHARP LHF8OV13 Stan BUS operation Command Comment.9 Write ?OH. Block Address Write Erase Setup Data=?OH Addr=Witbin Daca=WH Ad&=Within Block to be Erased Write Write DOH. Block Address Read Block to be Erased Swtus Regater Data Erase Loop standby Check SR.7 l=WSM Ready OzWSM Busy Repeat for subsequent block eraw,es. Full sta& check can be done after each block erase or after a sequence of block erawres. Write FFH after the last operation 10 place devxe in read array mode. Full Status Check If Desired FULL STATUS CHECK PROCEDURE BUS operation Command Check SR.3 l=Vpp Enor Detect Check SR.1 I=Device Prolect Detect Check SR.4.5 Both I=Command Comments Read Status Register Data(See Above) Standby Standby Standby Sequence Error staodhy Check SR.5 l=Block Erase Error SR.jSR.4SR.3 and SR.1 are only cleared by the Clear Status Register Command in cakes where multiple blocks are erased &fore full status is checked. If error is detected. clear the Sratw Register befae attempting retry or mher error reccwery. Block Erase Error Block Erase Successful Figure 5. Automated Block Erase Flowchart Rev. 1.0 SHARI= BUS operation Command write Setup Wordmyte Wri1e Dau=4OH OT 10H Addr=Location m Be Wnlten Datz=Daa to Be Written Ad&Location to Be Written Write Word/Byte Write Read Status Register Data Standby Check SR.7 l=WSM Ready O=WSM Busy Repeat for subsequent byte writes. SR full s&s check can be done aiier each WordiByte mile. or after a sequence of WcdByTe writes. Write FFH after the last WadApe mte operaooo to place- device m read array mode. FULL STATUS CHECK PROCEDURE Read Status Register Data(See Above) BUS operation Standby Command Comments Check SR.3 l=Vpp Error Detect Check SR.l l=Device Protect Detect Check SR.4 l=Data Write Error Standby Standby Device Protea Error SR.4.SR.3 and SR. I are ooly cleared by the Clear Status Register command in cases where multiple locations are written before full status is checked. If error 1s detected. clear the Status Register before attempting retry or other e*n recovery. Figure 6. Automated Word/Byte Write Flowchart Rev. 1.0 SHARP LHF8OV13 BUS operation Command Comments write EraJe Suspend Data=BOH Addr-X Siatuv Register Data Ad&X Check SR.7 I=WSM Ready O=WSM Busy Check SR.6 I=Blwk Erase Suspended OzBlock Erase Completed Read Standby Standby Write Erase R&VJllle Data=DOH Addr=X Figure 7. Block Erase Suspend/Resume Flowchart Rev. 1.0 SHARP LHF8OV13 19 BUS operation Command Comments Write Word/Byte Write Suspend Dau=BOH Adh=X Status Register I Addr-X Read I Read Array Word/Byte Complet Data=FFH Ad&=X Figure 8. Word/Byte Write Suspend/Resume Flowchart Rev. 1.0 SHARP LHF8OV13 5 DESIGN CONSIDERATIONS 5.1 Three-Line Output Control The device will often be used in large memory arrays. SHARP provides three control inputs to accommodate multiple memory connections. Three-line control provides for: a. Lowest possible memory power dissipation. b. Complete assurance that data bus contention will not occur. To use these control inputs efficiently, an address decoder should enable CE# while OE# should be connected to all memory devices and the system's READ# control line. This assures that only selected memory devices have active outputs while deselected memory devices are in standby mode. RP# should be connected to the system POWERGOOD signal to prevent unintended writes during system power transitions. POWERGOOD should also toggle during system reset. 20 5.3 Power Supply Decoupling Flash memory power switching characteristics require careful device decoupling. System designers are interested in three supply current issues; standby current levels, active current levels and transient peaks produced by falling and rising edges of CE# and OE#. Transient current magnitudes depend on the device outputs' capacitive and inductive loading. Two-line control and proper decoupling capacitor selection will suppress transient voltage peaks. Each device should have a 0.1 $ ceramic capacitor connected between its V,, and GND and between its V,, and GND. These high-frequency, low inductance capacitors should be placed as close as possible to package leads. Additionally, for every eight devices, a 4.7 pF electrolytic capacitor should be placed at the array's power supply connection between V,, and GND. The bulk capacitor will overcome voltage slumps caused by PC board trace inductance'. 5.4 Vpp Trace on Printed Circuit Boards Updating flash memories that reside in the target system requires that the printed circuit board designer pay attention to the V,, Power supply trace. The V,, pin supplies the memory cell current for word/byte writing and block erasing. Use similar trace widths and layout considerations given to the V,, power bus. Adequate V,, supply traces and decoupling will decrease V,, voltage spikes and overshoots. 5.2 RY/BY#, Block Erase and Word/Byte Write Polling RY/BY# is an open drain output that should be connected to V,, by a pulllup resistor to provide a hardware method of detecting block erase and word/byte write completion. It transitions low after block erase or word/byte write commands and returns to High Z when the WSM has finished executing the internal algorithm. RY/BY# can be connected to an interrupt input of the system CPU or controller. It is active at all times. RY/BY# is also High Z when the device is in block erase suspend (with word/byte write inactive), word/byte write suspend or deep power-down modes. Rev. 1.1 SHARP LHF8OV13 5.5 VCC, Vpp, RP# Transitions Block erase and word/byte write are not guaranteed if V,, falls outside of a valid V,,,,,, range, V,, falls outside of a valid 2.7V-3.6V range, or RP##V,, or V,,. If V,, error is detected, status register bit SR.3 is set to "1" along with SR.4 or SR.5, depending on the attempted operation. If RP# transitions to V, during block erase or word/byte write, RY/BY# will remain low until the reset operation is complete. Then, the operation will abort and the device will enter deep power-down. The aborted operation may leave data partially altered. Therefore, the command sequence must be repeated after normal operation is restored. Device power-off or RP# transitions to V, clear the status register. The CUI latches commands issued by system software and is not altered by V, or CE# transitions or WSM actions. Its state is read array mode upon power-up, after exit from deep power-down or after V,, transitions below VLKo. After block erase or word/byte write, even after V,, transitions down to V,,,,: the CUI must be placed in read array mode via the Read Array command if subsequent access to the memory array is desired. 21 A system designer must guard against spurious writes fol V,- voltages above VLKO when V,, is active. Since botl WE# and CE# must be low for a command write, driving either to V,, will inhibit writes. The GUI's two-steI command sequence architecture provides added level 01 protection against data alteration. WP# provide additional protection from inadvertent code or data alteration. The device is disabled while RP#=V, regardless of its control inputs state. 5.7 Power Dissipation When designing portable systems, designers must considei battery power consumption not only during device operation, but also for data retention during system idle time. Flash memory's nonvolatility increases usable battery life because data is retained when system power is removed. In addition, deep power-down mode ensures extremely low power consumption even when system power is applied. For example, portable computing products and other power sensitive applications that use an array of devices for solid-state storage can consume negligible power by lowering RP# to V, standby or sleep modes. If access is again needed, the devices can be read following wake-up cycles required after RP# is *e `PHQV and tPHWL first raised to VI,. See AC Characteristics- Read Only and Write Operations and Figures 11, 12, 13 and 14 for more information. 5.6 Power-Up/Down Protection Ihe device is designed to offer protection against accidental block erasure or word/byte writing during power transitions. Upon power-up, the device is indifferent as to which power supply (V,, or V,,) ?owers-up first. Internal circuitry resets the CUI to read uray mode at power-up. J Rev. 1.0 SHARP LHF8OV13 6 ELECTRICAL SPECIFICATIONS 22 6.1 Absolute Maximum Ratings* Operating Temperature During Read, Block Erase and Word/Byte Write .. ..... ..... ...... ...... ..... .-40C to +85"C(`) Temperature under Bias ......_.._._._........ -40C to +85"C Storage Temperature ... ..... ...... ...... ...... .... .. -65C to +12X Voltage On Any Pin (except V,,, V,,, and RP#) . ...... ..... - 0.5v to +7.ov(*) V,- Supply Voltage ... ..... .._................... -0.2v to +7.ovQ) V, Update Voltage during Block Erase and Word/Byte Write .... .... . -0.2V to +14.0V(2*3) RF% Voltage .... ..... .... ..... ...... ..... ...... ..... -0.5V to +14.0V(2,3) Output Short Circuit Current ..... ...... .... ....... ....... ... lOOn~4(~) *WARNING: Stressing the device beyond the "Absolutt Maximum Ratings" may cause permanent damage. Thest are stress ratings only. Operation beyond the "Operating Conditions" is not recommended and extended exposurt beyond the "Operating Conditions" may affect devict reliability. NOTES: 1. Operating temperature is for extended temperature product defined by this specification. 2. All specified voltages are with respect to GND Minimum DC voltage is -0.5V on input/output pinr and -0.2V on V,, and V,, pins. During transitions this level may undershootto -2.OV for periods<20ns Maximum DC voltage on input/output pinsand V,, is V,,+O.5V which, during transitions, may overshoottc Vcc+2.0V for periods<20ns. 3. Maximum DC voltage on V,, andRP## overshool may to +14.OV for periodsc20ns. 4. Output shortedfor no morethan onesecond. more No than one output shortedat a time. 6.2 Operating Conditions Temperature V,, OperatingConditions and Symbol Parameter Min. Max. Unit T, OperatingTemperature -40 +85 "C V,, V,, Supply Voltage (2.7V-3.6V) 2.7 3.6 V Test Condition Ambient Temperature 5.2.1 CAPACITANCE(l) Symbol Parameter C,, Input Capacitance CO", Output Capacitance VOTE: 1. Sampled,not 100%tested. T,=+25"C, f=lMHz Max. TYP. 7 10 9 12 Unit PF pF v,=o.ov V,,,=o.OV Condition Rev. 1.0 SHARP LHF8OV13 6.2.2 AC INPUT/OUTPUT TEST CONDITIONS 23 I AC test inputs are driven at 2.7V for a Logic "1" and O.OV for a Logic "0." Input timing begins, and output timing ends, at 1.35V. Input rise and fail times (10% to 90%) ~10 ns. Figure 9. Transient Input/Output Reference Waveform for V,,=2.7V-3.6V Test Configuration Capacitance Loading Value Test Configuration C,(pF) 30 V,,=2.7V-3.6V lN914 CL Includes Jig Capacitance Figure 10. Transient Equivalent Testing Load Circuit Rev. 1.01 SHARP LHF8OV13 5.2.3 DC CHARACTERISTICS DC Characteristics V,,=2.lV-3.6V Notes MaX. TYP. 1 *OS 1 1,3,6, 10 1,3,6 0.2 `CC, 24 Sym. IL1 Parameter Input Load Current Output Leakage Current V,, Standby Current Unit PA ClA ClA mA Test Conditions VCC=VCCMax. V,,=Vcc or GND IL0 kO.5 25 50 ICC, 2 20 25 V,, Deep Power-Down V,, Read Current Current 1,lO 1,576 5 15 fl mA ICCR 30 kcw V,, Word/Byte Write Current 1,7 5 17 mA mA CMOS Inputs V,,=V,,Max. CE#=RP#=V,@.2V TTL Inputs VCC=VCCMax. CE#=RP#=V,, RP##=GND+0.2V I,, (RY/BY#)=OmA CMOS Inputs VCC=VCCMax~C.,C=GND f=SMHz, I,, TTL Inputs yc5=$IMax.. CE#=GND = OUT=OmA V,=2.7;-3.6V Rev. 1.0 SHARP LHF8OV13 DC Characteristics (Continued) V,,=2.7V-3.6V Notes Min. Max. 7 7 3,7 3,7 397 2.4 0.85 -0.5 2.0 0.8 Vcc 25 SYm. VI, VIH VOL `OH1 `OH2 Parameter Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage u-w Output High Voltage (CMOS) Unit V V V V V V Test Conditions +os 0.4 V,, !& V,,=V,, Min. IoL=2.0mA V,,=V,, Min. I,,=- 1.5d V,,=V,, Min. I,,=-2.om.A V,,=V,, Min. I,,=- lOOpA `PPLK `PPHl `PPH2 `LKO 2.0 V V, UnavailableWP# 11.4 12.6 V 83 JOTES: . All currentsarein RMS unless otherwisenoted.Typical valuesat nominalV,, voltage andT,=+25"C. If suspend mode.the . `CCWS and `CCES are specifiedwith the device de-selected. read or word/byte written while in erase device'scurrentdraw is the sumof I,,,, or ICC-sand ICCR Iccw, respectively. or . IncludesRY/BY#. . Block erases word/byte writes are inhibited when Vpp 4,7 2.7 1.5 3.6 V V V 11.4 12.6 Rev. 1.01 SHARP LHF8OV13 6.2.4 Sym. AC CHARACTERISTICS ) - READ-ONLY V,,=2.i'V-3.6V, Parameter OPERATIONS(l) T,=-40C to +85X Notes Min. Max. 1 Unit t-EHoZ bLoX tGHO7 tOH II tFVOV $Jop. tELzv NOTES: 1. See AC Input/Output Reference Waveform for maximum allowable input slew rate. 2. OE# may be delayed up to tELQv-tCLQv after the falling edge of CE# without impact on tELQv. 3. Sampled, not 100% tested. 4. If BYTE# transfer during reading cycle, exist the regulations separately. CE# High to Output in High Z OE# to Output in Low Z OE# High to Output in High Z Output Hold from Address, CE# or OE# Change, Whichever Occurs First BYTE# and A-, to Output Delay BYTE# Low to Output in High Z CE# to BYTE# High or Low 3 3 3 3 3 3 3,4 55 0 20 0 90 30 5 ns ns ns ns I I ns ns ns Rev. 1.01 SHARF' LHFSOV13 27 r Standby VIH @DRESSES(A) VIL Device Address Selection Address Stable Data Valid --_-------- tOH+--4 VOH DATA(D/Q) --__----_-_ \ \ HIGH Z _____-_-_-_ 7 (DQo-DQA VOL [ / I- HIGHZ VIH RP#(P) VU Figure 11. AC Waveform for Read Operations Rev. 1.0 SHARP LHF8OV13 Device Address Selection f L 4 Data Valid Address Stable CE#(E) 117 OE#(G) ::r . In BYTEWI VU VOH DATA(D/Q) HIGH Z @Qo-DQ-r) VOL 4 DATA(D/Q) HIGH Z HIGH Z :DQs-DQts) VOL Figure 12. BYTJ3# timing Waveform Rev. 1.0 SHARP LHF8OV13 29 6.2.5 AC CHARACTERISTICS - WRITE OPERATIONS(I) NOTES: 1. Read timing characteristics during block erase and word/byte write operations are the same as during read-only operations. Refer to AC Characteristics for read-only operations. 2. Sampled, not 100% tested. 3. Refer to Table 4 for valid A,, and D,, for block erase or word/byte write. 4. V, should be held at V,,,,, ( and if necessary RP# should be held at V,) until determination of block erase or word/byte write success (SR.1/3/4/5=0). 5. If BYTE# switch during reading cycle, exist the regulations separately. Rev. 1.01 SHARP LHF8OV13 30 ADDRESSES(A) CE#(Ej OE#(G) WE#(W) DATACDIQ) BYTE#(D RY/BY#(R) vppw NOTES: 1. VCC power-up and standby. 2. Write block erase or word/byte write setup. 3. Write block erase confirm or valid address and data. 4. Automated erase or program delay. 5. Read status register data. 6. Write Read Array command. Figure 13. AC Waveform for WE#-Controlled Write Operations Rev. 1.0 SHARP LHF8OV13 6.2.6 ALTERNATIVE CE#-CONTROLLED WRITES(l) 31 NOTES: 1. In systems where CE# defines the write pulse width (within a longer WE# timing waveform), all setup, hold, and inactive WE# times should be measured relative to the CE# waveform. 2. Sampled, not 100% tested. 3. Refer to Table 4 for valid A,, and D,, for block erase or word/byte write. 4. V, should be held at VPPHIR ( and if necessary RP# should be held at VHH) until determination of block erase or word/byte write success (SR.1/3/4/5=0). 5. If BYTE# switch during reading cycle, exist the regulations separately. Rev. 1.Ol SHARI= 32 VIH ADDRESSES(A) VIL VIH CE#(E) VIL VIH OE#(G) WE#(WI VIH VIL VIH I %HwH High Z tPHEL ' hEH 11 fEHFV \ I I DATAi.D/Q) VIH BYTENF) , l-l- w w I RY/BY#fR) hHEH l VIH f t VHHI RF'N') VIH f+Ej . . I . . fy I NOTES: 1. VCC power-up and standby. 2. Write block erase or word/byte write setup. 3. Write block erase confii or valid address and data. 4. Automated erase or program delay. 5. Read status register data. 6. Write Read Array command. Figure 14. AC Waveform for CE#-Controlled Write Operations Rev. 1.0 SHARF' LHF8OV13 6.2.7 RESET OPERATIONS 33 RY/BY#(R) VOL VIH =wP) VIL (A)Reset High Z RYiBY#(R) VOL VIH RWP) VIL During Read Array Mode (B)Reset During 2.w vcc VIL VIH Block Erase or Word/Byte Write L t2VPH - RP#(P) VIL a I (C)RP# rising Timing Figure 15. AC Waveform for Reset Operation Reset AC Specifications Sym. `PLPH tpL&J t2VPH Parameter `RP# Pulse Low Time (If RP# is tied to V,,, this specification is not applicable) RP# Low to Reset during Block Erase or Word/Byte Write V,, 2.7V to RP# High Notes V,,=2.7V-3.6V Min. Max. 100 Unit ns 12 3 22 100 PS ns qoTEs: . If RP#/ is asserted while a block erase or word/byte write operation is not executing, the reset will complete within loons. !. A reset time, tpHQv, is required from the later of RY/BY# going High Z or RP# going high until outputs are valid. 1. When the device power-up, holding RP# low minimum lOOtis is required after V,, has been in predefined range and also has been in stable there. Rev. 1.0 SHARP LHFSOV13 6.2.8 BLOCK ERASE AND WORD/BYTE WRITE PERFORMANCE(3) Block Write Time NOTES: 1. Typical values measured at T,=+25"C and nominal voltages. Subject to change based on device characterization. 2. Excludes system-level overhead. 3. Sampled but not 100% tested. 4. All values are in word mode (BYTE#=V,,). At byte mode (BYTE#=V,,), those values are double. Rev. 1.0 SHARP 7 Package and packing specification 1 LHF80V13 35 1. Package Out line Specification Refer to drawing No.AAl 14 2 2. Markings 2 - 1. Marking contents ( 1) Product name : LH28F800BVHE-BTL90 ( 2 > Company name : SHARP ( 3) Date code xxx Indicates (Example) Y Y WW the product was manufactured ref.code week. (l-3) E Denotes the production Denotes the production ~~~~_~~~~~~~c::.:`:.r. (4) The marking of "JAPAN" indicates 14 2 the dimensions (Lower two digits of the year.) the country of origin. 2 - 2. Marking layout Refer drawing No.AAl (This layout does not define 3. of marking character and marking position.) Packing Specification (Dry packing for surface mount packages) Dry packing is used for the purpose of maintaining IC quality after mounting packages on the PCB (Printed Circuit Board). When the epoxy resin which is used for plastic packages is stored at high humidity, it may absorb 0.15% or more of its weight in moisture, If the surface mount type package for a relatively large chip absorbs a large amount of moisture between the epoxy resin and insert material (e.g. chip,lead frame) this moisture may suddenly vaporize into steam when the entire package is heated during the soldering process (e.g. VPS). This causes expansion and results in separation between the resin and insert material, and sometimes cracking of the package. This dry packing is designed to prevent the above problem from occurring in surface mount packages. 3 - 1. Packing Materials Material Name Material Specificaiton Purpose Tray Conductive plastic (50devices/tray) Fixing of device ________________-_______________________------------------------------------------------------------------------.-------------------------------____________ Conductive plast ic Upper cover tray (ltray/case) Fixing of device ________________________________________---------------------------------------------------------------_-______-_______________________________------------Laminated aluminum bag Aluminum polyethylene (lbag/case) Drying of device ________________________________________---------------------------------------------------.----------------------------------------------------------------Silica gel Des i ccant Drying of device __._---_____.--_________________________~~-~~~~-~~~~~---~~.------~---~.~~~~~~~~~~~~~~~-~~~~~-~~~~~~-~~~~~-~~~~-~~~~~-~~~~~~~~~~~----~~ P P band Polypropylene Fixing ,of tray (3pcs/case) ________________________________________-----------------------------------------------------.-------------------------------------------------------.------Inner case Card board (500device/case) Packaging of device ________________________________________--------------------------------------------------------------------------------------------------------------------Label Paper Indicates part number, quant ity and date ________________________________________---------------------------------------------------------------- of manufacture -___ _ __ __ __________-_____---_____________________---Outer case Card board Outer packing of tray (Devices shall be placed into a tray in the same direction.). SHARP 3-2. Outline dimension Refer to attached of tray drawing LHF80V13 36 4. 4-l. Storage and Opening of Dry Packing the dry packing Store under conditions shown below before opening (1) Temperature range : 5-40C : 80% RH or less (2) Humidity 4 - 2. Notes on opening the dry packing (1) Before opening the dry packing, prepare a working tabIe which is grounded against ESD and use a grounding strap. (2) The tray has been treated to be conductive or anti-static. If the device is transferred to another tray, use a equivalent tray. 4 - 3. Storage after opening the dry packing Perform the following to prevent absorption of moisture after opening. (1) After opening the dry packing, store the ICs in an environment with temperature of 5~25C and a relative humidity of 60% or less and after opening dry packing. mount ICs within 72 hours Baking (drying) before mounting ( 1) Baking is necessary (A) If the humidity ind i cator in the desiccant becomes pink (B) If the procedure in section 4-3 could not be performed ( 2) Recommended baking condit i ons bake it before If the above conditions ( A) and (B) are applicable, mounting. The recommended conditions are 16-24 hours at 120C. Heat resistance tray is used for shipping tray. Mount Conditions Please perform the following quality. a 4 - 4. 5. Surface conditions when mounting ICs not to deteriorate IC 5- ne time sqlder ing.) 1 .Solderinn conditions(The following conditions are valid only for Temperature and Duration 71 Mounting Method Ref low solder ing Peak temperature of 230C or less, surface duration of less than 15 seconds. (air) 200C or over,duration of less than 40 seconds. Temperature ________-_______________________________~~~~~~~-~.~--~~-~---~~~.~--~~--~.-~------.-. _. ____________.-___________________ increase rate of l-4YYsecond 260C or less, duration of less Manual soldering than 10 seconds. (soldering iron) c a - 2. Conditions for removal of residual ( 1) Ultrasonic washing power (2) Washing time (3) Solvent temperature flux : 25 Watts/liter : Total I minute : 15%40C or less maximum SHARI= LHF80V13 37 1 ! f JAPAN YYWW xxx 24 -- I 0 /SEE DETAIL A DETAIL A PKG.BASE PLANE #T; RAWING NO. ME j TSOP48-P-1220 9 - F{kk. LEAD FINISH *4I2 j AA1142 UNIT 1 TIN-LEE R% 77~f~ b~~+h'##&, /~rlQ$&Mh!% o ( PLATING NOTE Plastic body dimensions do not include j of resin. j mm burr SHARP LHF80V13 38 W cn io M it% 1 4iw \ME;TSOP48-1220TCM-RH s4cz j JRAWING j CV756 NO. UNIT j mm NOTE SHARI= @upplementary data) LHF80V13 39 LHF80V13 Recommended mounting Product name(Package) Packing specification Mounting method Reflow soldering conditions conditions for two time reflow soldering . LH28F800BVHE-BTL90 (TSOP48-P-1220) Tray (Dry packing) Reflow soldering (Air) Peak temperature of 230C or less. 200C or over, duration of less than 40 seconds. Preheat temperature of 125-15O"C, durat ion of less than 180 seconds. Temperature increase rate of l-4Ws econd , IC package surface After opening the dry packing, store the ICs in an environment with a temperature of 5-25C and a relative humidity of 60% or less. If doing reflow soldering twice,do the first reflow soldering within 72 hours after opening dry packing and do the second reflow soldering within 72 hours after the first reflow soldering. If the above storage conditions are not applicable, bake it before reflow soldering. The recommended conditions are 16-24 hours at 120C. (Heat resistance tray is used for shipping tray:) Measurement Storage point conditions Note Recommended Reflow Soldering(Air) Temperature Profile Preheating Peak 230C temper *ature MAX. ,,~~~~~~~ rate Time I-IC/second (NO. 980807-X14) SHARI= LHF8OV13 Flash memory LHF8OVXX family Noises having a level Data Protection the limit conditions 40 (TSOPpackage. CSPpackage) specified in the specification may be interpreted may be as false systems designs, as exceeding operating generated under specific on some systems. Such noises, To protect operating appropriate: 1) Protecting By setting Parameter when induced onto WE# signal undesired the data stored or power supply, commands, causing memory updating. in the flash memory against unwanted overwriting, write protect with the flash memory should have the following data in specific a WP# to low, only block the boot block can be protected against overwriting. and main blocks etc., cannot be locked. them in the boot block. operation is enabled for al 1 blocks. to the specification. to RP#, overwrite System program, For further (See chapter can be locked by storing is applied on control1 When a high voltage 4.10) information ing of WP# and RP#, refer 2) Data protection When the level flashmemory write protected. through Vpp voltage), write operation on the intheblocksarecompletely (See chapter 4.10 and 6.23. > of Vpp is lower than VPPLK (lockout is disabled. voltage, All blocks are lockedandthedata refer RP# to the specification. For the lockout 3) Data protect transition, blocks. ion through operation When the RP# is kept write low during power up and power down sequence such as vo 1 tage memory is disabled, write protecting all on the flash For the detai 1s of RP# control, 4) Noise rejection Consider noise of WE# refer to the specification. (See chapter 5.6 and 6.2.7. > rejection of WE# in order to prevent false write command input. Rev 1.01 |
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